Dr Chao Wang
Senior R&D Manager Engineering Adhesives, H.B. Fuller Company, St Paul, Minnesota, USA
Chao Wang earned a Ph.D. in Polymer Science from Virginia Tech in 2014. He joined H.B. Fuller in 2015 and has over ten years of experience in the adhesive industry, with a strong focus on developing innovative adhesive technologies and formulations for electronics applications. Chao currently serves as Senior R&D Manager for the H.B. Fuller North America Electronics team, where he leads a team focused on advancing innovative solutions across polyurethane, acrylate, epoxy, and silicone chemistries. His background spans product research and development as well as technical leadership, through which he has driven innovation and addressed complex technical challenges. Adhesive solutions developed under his leadership generate multi-million-dollar annual revenues. Chao has published over 20 peer-reviewed articles and patents.
Removeable Polyurethane Adhesive for Consumer Electronics
Polyurethane-based Hot Melt Moisture Curable (HMMC) adhesive is a leading adhesive solution for touch panel bonding & assembly in portable electronic device manufacturing for its good bonding performances, reliability, processability and reworkability. According to the EU Ecodesign Regulation for Smartphones and Tablets, which came into force in June 2025, fasteners may only be used if they can be removed with commercially available tools and with a reasonable level of effort, without leaving residues that would prevent the product from being reassembled. To meet these requirements, H.B. Fuller has introduced one-component polyurethane-based adhesives designed specifically for portable electronic device repair. This polyurethane based system consists of a short clamping HMMC adhesive suitable for fully automated processes in repair service centers, as well as a manually applicable Liquid Moisture Curable (LMC) adhesive designed for DIY repair kits. The presentation will provide detailed insights into the chemistry, performance, and processing of these materials.
Conclusion: Reworkable adhesives combined with an easy to apply DIY product offer a compliant solution for the EU Ecodesign Regulation for Smartphones and Tablets. They are also well positioned to meet future requirements, including those anticipated under the Ecodesign for Sustainable Products Regulation (ESPR), in force since 2024, which is expected to introduce product specific obligations starting in 2027/2028.
Breakout Session VI – Reversible & On‑Demand Debonding – 17 September 2026 – 11:30 – 12:00 – Room Whittle – F3