Michał Dudek
R&D Manager double as QC Section Manager, Tex Year Europe Sp. z o. o.
Michał Dudek is the R&D Manager at Tex Year Europe and also serves as QC Section Manager, bringing 10 years of experience in the adhesive industry. His work focuses on the development of sustainable adhesive technologies, including conventional hot melt, bio-based and biodegradable systems, as well as advanced bonding solutions. He is also responsible for QA/QC operations, production support, and integrated management systems, including ISO 9001, ISO 14001, ISO 45001, and HACCP, for which he acts as a management representative.
He holds an engineering degree in Chemical Technology and specializes in polymer materials, adhesive formulation, and process optimization. Michał is actively engaged in cross-industry innovation projects, regulatory compliance, and cross-functional collaboration across international markets, supporting the development of circular and high-performance adhesive solutions across multiple industrial applications and throughout the supply chain.
Green Platform Strategy: Enabling Circular Manufacturing and Scope 3 Decarbonization Across Industries
As industries accelerate toward net-zero emissions and circular economy transformation, Scope 3 decarbonization has become a critical challenge across global supply chains. Although adhesives are used in relatively small quantities, they significantly influence recyclability, energy consumption, waste reduction, and product carbon footprints.
This presentation introduces Tex Year’s Green Platform Strategy (GPS), aligned with United Nations SDG17 “Partnerships for the Goals,” as a collaborative framework connecting material suppliers, chemical companies, recycling systems, research institutes, and downstream industries to accelerate sustainable manufacturing and circular innovation.
The presentation demonstrates how adhesive technologies contribute to low-carbon manufacturing through material innovation, process optimization, and life cycle thinking. Examples include compostable fruit-label hot melt adhesives fully biodegrading within 120 days, bio-based hot melt systems reducing carbon emissions by more than 20%, and Innofusion® recycling-oriented adhesive systems lowering furniture product carbon footprints by approximately 28%.
Packaging applications demonstrate particularly strong decarbonization potential. Low-temperature hot melt adhesives can reduce operational electricity consumption by up to 68%, while lightweight packaging positioning adhesives may reduce more than 1,000 tons of secondary plastic packaging annually and lower CO2e emissions by 10–45%.
In electronics manufacturing, MiniLED NCSP packaging technologies may reduce manufacturing carbon footprints by 40–60%, low-temperature OCA rework systems may reduce process emissions by 50–70%, and UV LED curing technologies can reduce Scope 2 electricity-related emissions by up to 90%.
The presentation also introduces ultra-low VOC hot melt adhesives for semiconductor clean-room filtration systems and ongoing collaboration with Taiwan’s Industrial Technology Research Institute (ITRI) on advanced semiconductor debonding technologies.
Through low-carbon materials, circular design, and SDG17-based collaboration, GPS demonstrates how the adhesive industry can evolve into a sustainable innovation platform supporting circular economy transformation and Scope 3 decarbonization.
Breakout IV – From Evidence to Impact: Future-Proofing Industry – 16 September 2026 – 16:30 – 17:00 – Room Mountbatten – F6