Kazuaki Okada
Engineer, Research ＆ Development Department, Cemedine Co., Ltd
Kazuaki graduated from Department of Chemistry, Graduate School of Science, Hiroshima University in 2016. He joined the CEMEDINE CO., LTD. in 2016. He has been working on development elastic adhesive and sealant. He is currently in charge of developing sealant for construction.
Development of Cleanroom Sealants for Semiconductor Manufacturing Environments
We have developed a sealing material with an extremely low level of outgassing that is suitable for use in semiconductor manufacturing cleanrooms. In recent years, as semiconductor devices have become increasingly high performance, the level of cleanliness required for their manufacturing environments has become more stringent. Airborne contaminants are an important factor affecting device yield during semiconductor manufacturing, and sealing materials, which are widely used throughout semiconductor manufacturing environments, can potentially become sources of airborne contamination. For example, silicone based sealing materials have the issue of containing low molecular weight cyclic siloxanes. In addition, polyurethane based sealing materials have the drawback that surface tackiness remains even after curing, making them prone to dust adhesion. To address these issues, we have developed a sealing material exhibiting a high level of low outgassing performance. In particular, excellent outgassing performance was achieved by selecting non volatile components. Moreover, by using a silyl terminated polyether polymer as the main component, the developed sealing material does not contain low molecular weight cyclic siloxanes, unlike conventional silicone based sealing materials, and is therefore suitable for use in semiconductor manufacturing cleanrooms. Furthermore, by optimizing the curing properties, surface tackiness disappears rapidly after curing, and by adjusting the hardness of the cured film, adhesion of dust to the surface of the sealing material can be prevented. With respect to adhesion, the sealing material also exhibits good adhesion to materials assumed to be used in cleanroom environments, even without the use of a primer. Owing to these characteristics, the developed sealing material is a useful cleanroom construction material for semiconductor manufacturing environments that are expected to become increasingly advanced in the future.
Co-authors:
Masato Akimoto, Yasushi Hatta
Breakout Session VIII – SMP Formulation: From Design to Application – 17 September 2026 – 12:30 – 13:00 – Room Mountbatten – F6