Dr Helena Cheminet

Global R&D Director, Bostik

Chemical Engineer, Polymer Science PhD
15+ years experience of developing polymer-based technologies within Arkema (high performance materials) and then Bostik (adhesives). Held several positions of technical support, business development and R&D management in France and USA.
Current role Global R&D Director for Bostik’s Durable Goods business unit, with a strong focus on Engineering Adhesives

The Other Side of Adhesion. Why, Where and How Debonding is Engineered?

Adhesives are designed to keep things together. But what if the ability to let go becomes just as important? From everyday products to highly engineered applications, debonding is opening new possibilities and challenging how we think about adhesion. So why do we want a bond to fail? Where does controlled debonding make sense? And how can we make it happen? This session will explore the other side of adhesion through examples, concepts and a glimpse into the science behind making a bond let go—when we want it to.

Breakout Session VI – Reversible & On‑Demand Debonding – 17 September 2026 – 12:30 – 13:00 – Room Whittle – F3