Chia Liang
Assistant Manager, Nanpao Resins Chemical Co. Ltd
Chia-Liang (Peter) Lin holds a Master’s degree in Chemical Engineering from National Cheng Kung University in Taiwan, where he specialized in polymer synthesis and nanocomposite material preparation. Throughout his career, Mr. Lin has dedicated his expertise to the R&D of advanced water-based adhesive systems. His extensive technical portfolio encompasses waterborne polyester polyols, waterborne polyurethane (PUD), acrylic emulsions, polyvinyl acetate (PVAc) emulsions, and vinyl-acetate ethylene (VAE) copolymer emulsions.
Since joining NanPao Resins Group in 2006, he has focused on the application and development of sustainable waterborne technologies. Currently serving as Assistant Manager, he provides technical leadership in engineering eco-friendly solutions, such as high-performance binders for industrial, textile, and electronics applications, driving the industry’s transition toward low-carbon innovation and green chemistry.
Sustainable High-Performance Adhesives: From Bonding to Semiconductor Debonding
As the adhesive industry faces the urgent challenge of reaching Net Zero 2050, the focus must shift toward “Sustainable Precision Adhesion.” This presentation explores how high-performance materials can be engineered to bridge the gap between traditional industrial bonding and advanced semiconductor processing through green chemistry.
At the industrial level, we demonstrate a transformative shift from solvent to water-based systems, achieving a 50% reduction in GHG emissions. A primary highlight is our water-based Lithium Battery Binder, which replaces toxic PVDF/NMP systems and lowers drying temperatures from ≥150°C to ≤100°C, significantly enhancing energy efficiency in EV supply chains. Furthermore, our Liquid PUR (LPUR) technology reduces annual lamination power consumption from 57,600 kWh to 0 kWh, saving customers 28,454 KgCO2e annually.
In the textile sector, we address the technical hurdles of coating fluorine-free (NF) fabrics by optimizing surface tension matching (36 vs. 42 dyn/cm) to eliminate pinholes and adhesive bleeding.
The presentation reveals the science behind UV cure release tapes for semiconductor manufacturing. By triggering a 3D network structure via UV irradiation, adhesion drops from 1500–2000 g/inch to <30 g/inch, ensuring clean, residue-free debonding and maximizing wafer yield.
Finally, we demonstrate Circular Economy integration, such as resynthesizing polyols from recycled PET and utilizing semiconductor waste SiO2 in high-performance coatings. These innovations prove that sustainability and extreme performance are mutually reinforcing pillars of future adhesive technology.
Breakout Session VI – Reversible & On‑Demand Debonding – 17 September 2026 – 12:00 – 12:30 – Room Whittle – F3